Production form factor is a strong determinant of the product produced and cost per unit. Currently, majority of electronics are produced in a semi-batch sheet-to-sheet (S2S) process flow. In this mode, each board is fed through individual steps in sequence. However, in such a format, the size of the board is limited, the substrate would need to be dimensionally stable and the unit costs would be high. Consider the case of building an illuminated wall. In a S2S format, the illuminated wall will need to be in smaller pieces stitched together, the wall will be built on a rigid substrate, and has been cost prohibitive because of manufacturing and instillation costs.
What if the illuminated wall could be built like old fashion wall paper?
This is the final article of the series on conductive ink experiments. Let’s review the highlights of what we’ve learned, and summarize how we might use those lessons in a flexible circuit board design.
Transient Analysis
In this post we will examine some transient response tests as a function of trace resistance. And I’ve found the solution of the less-than-perfect serial port errors. This is part 7 of the series on conductive inks, and will wrap up the experiments portion of this series. The next and final post will be a summary of lessons learned.
In this post we will wrap up part 6 by looking at some DC performance tests (apologies in advance for the fact that these tests are not very photogenic). And I’ll also dig a little deeper in the mystery of the serial port errors from 
- By Harry Chou
- Posted In Photonic Soldering
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We’ve talked about the various ways photonic soldering simplifies the soldering process, like how the PulseForge can be thought of like a grill. Here, I’m sharing an example of how photonic soldering can help engineers overcome design limitations they face when creating new devices for the 3D world around us, while traditional electronics designs have been constrained to 2D (rigid) substrates. We can overcome these limitations using photonic soldering.
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